SMT Manufacturing
SMT – Surface Mount Technology
Our modern SMT manufacturing stands for the highest quality and reproducible processes – from prototypes to series production. Thanks to several fully automated production lines, intelligent inspection systems and documented processes, we guarantee reliable and economical placement of complex electronic assemblies. State-of-the-art SPI and AOI systems monitor the entire manufacturing process.
Your Advantages at a Glance
- Air-conditioned, dust-free production with process heat recovery for maximum sustainability
- Fully automated, efficient and reproducible SMT processes
- State-of-the-art SPI and AOI inspection technologies
- Series and prototype production on identical equipment
- Programmed PCB supports from solder paste printing through the soldering process
- Laser surface measurement of the entire circuit board during placement to compensate for warpage
- Smallest components 01005 (imperial) up to largest 120 mm up to 30 mm in height
- Up to 360 different 8 mm tape components per line/assembly
- Each assembly with its own documented solder profile
Labeling
With our automated PCB labeling, we guarantee reliable and complete identification of your assemblies already during the SMT manufacturing process.
The customer-specific labels are prepared, printed on rolls and applied fully automatically and precisely directly on the SMT line – several labels according to customer specifications are possible. This enables efficient batch traceability and supports consistent production and quality documentation.
Solder Paste Printing
Precision begins with solder paste printing – with state-of-the-art printing technology, automated process monitoring and the highest manufacturing quality as the basis for stable SMT processes and reliable solder joints.
Print quality is fully automatically checked 100% in the following process using SPI (Solder Paste Inspection) and kept at an optimal level at all times thanks to a closed feedback loop to the stencil printing. The solder paste is prepared fully automatically, the stencil is cleaned automatically, and the print volume is automatically checked by laser measurement.
In addition, the PCB supports are program-monitored. This ensures a maximally reproducible printing process and minimizes the influence of manual intervention.
SPI (Solder Paste Inspection)
The fully automatic 3D SPI inspection monitors the solder paste print in real time with a control loop to the printing process and ensures the highest process reliability as well as reproducible high print quality. All pads of all assemblies are checked 100%.
SMT Placement
SMT placement is carried out on state-of-the-art, efficient, dynamic and fully automatic placement lines with high precision and maximum process reliability. Thanks to intelligent feeder monitoring, automatic optical component recognition and permanent process control, we guarantee reliable, high placement quality – from prototypes to large series production.
- Smallest components 01005 (imperial) up to largest 120 mm up to 30 mm in height
- Fully automatic THR (through-hole reflow) placement
- Double-sided placement with automatically applied SMD glue dots for heavy components
- Up to 360 different 8 mm tape components per line/assembly
- Programmed PCB supports (set automatically)
- Laser surface measurement of the entire circuit board to compensate for warpage
- Label/laser code scan for serial number capture
- Feeder-to-component linking and monitoring via scan
Reflow Soldering
Reflow soldering is carried out on state-of-the-art convection soldering systems with precisely monitored temperature profiles. Through controlled heat management, we guarantee gentle and reliable soldering of all SMT components as well as consistently high process quality and reproducibility.
Parameters such as temperature, airflow, PCB width, position of the PCB support, assembly spacing as well as transport speed are automatically taken from the respective assembly program. The optimal solder profile is determined and recorded once for each assembly; the process characteristics of the reflow soldering systems are measured and checked monthly.
